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High Thermal Conductivity Molybdenum Copper Flange For Rf Device Package Flange

Zhuzhou Jiabang Refractory Metal Co., Ltd
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    Buy cheap High Thermal Conductivity Molybdenum Copper Flange For Rf Device Package Flange from wholesalers
     
    Buy cheap High Thermal Conductivity Molybdenum Copper Flange For Rf Device Package Flange from wholesalers
    • Buy cheap High Thermal Conductivity Molybdenum Copper Flange For Rf Device Package Flange from wholesalers

    High Thermal Conductivity Molybdenum Copper Flange For Rf Device Package Flange

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    Brand Name : JBNR
    Model Number : 50MoCu,60MoCu,70MoCu,85MoCu
    Payment Terms : L/C, , T/T, Western Union
    Delivery Time : 15days
    Price : Negotiable
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    High Thermal Conductivity Molybdenum Copper Flange For Rf Device Package Flange

    MOLYBDENUM COPPER FLANGE FOR HERMETIC PACKAGES ELECTRONICS RF DEVICE PACKAGE FLANGE


    Description:


    Molybdenum Copper composite is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.


    Advantages:


    1. This molybdenum copper flange feature high thermal conductivity and excellent hermeticity.

    2. Molybdenum copper flange is much lighter than comparable tungsten copper composite,so it is more suitable for aerospace and other field.


    Product Properties:


    GradeMo ContentDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Thermal conductivity W/(M·K)
    85MoCu85±2%10.07160(25℃)/156(100℃)
    70MoCu70±2%9.87200(25℃)/196(100℃)
    60MoCu60±2%9.667.5222(25℃)/217(100℃)
    50MoCu50±2%9.510.2250(25℃)/220(100℃)

    Application:


    These composite are widely used in applications such as Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.


    Product picture:

    Quality High Thermal Conductivity Molybdenum Copper Flange For Rf Device Package Flange for sale
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