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0.05 Thickness Moly / Copper Heat Sink Material For Automobile Industry

Zhuzhou Jiabang Refractory Metal Co., Ltd
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    Buy cheap 0.05 Thickness Moly / Copper Heat Sink Material For Automobile Industry from wholesalers
     
    Buy cheap 0.05 Thickness Moly / Copper Heat Sink Material For Automobile Industry from wholesalers
    • Buy cheap 0.05 Thickness Moly / Copper Heat Sink Material For Automobile Industry from wholesalers
    • Buy cheap 0.05 Thickness Moly / Copper Heat Sink Material For Automobile Industry from wholesalers

    0.05 Thickness Moly / Copper Heat Sink Material For Automobile Industry

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    Brand Name : JBNR
    Model Number : 50MoCu,60MoCu,70MoCu,80MoCu
    Certification : ISO9001
    Price : Negotiable
    Payment Terms : L/C, , T/T, Western Union
    Delivery Time : 25days
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    0.05 Thickness Moly / Copper Heat Sink Material For Automobile Industry


    0.05 Thickness Moly / Copper Heat Sink Material For Automobile Industry


    Description:


    Zhuzhou Jiabang Refractory Metal Co. Ltd. is a premier manufacturer of the high performance thermal packaging solutions with composition-tailored materials including W/Cu, Mo/Cu, Cu/Mo/Cu, Cu/Mo70Cu/Cu. Through extensive R&D efforts, stringent manufacturing process, and strict quality control system, we have become a leading supplier of substrate and heatsink packages for semiconductor, optoelectronics, LED, aerospace, and defense industries. We strive to provide our customer high quality products, on-time delivery, outstanding customer services, and competitive pricing. Customer satisfaction is our ultimate mission!


    Advantages:

    Good machinability

    Good hermeticity

    Good thermal conductivity

    Good mechanical strength to provide excellent mechanical protection to the IC

    Molybdenum copper carriers are 40% lighter than comparable tungsten copper composite.


    Product Properties:

    GradeMo ContentDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Thermal conductivity W/(M·K)
    85MoCu85±2%10.07160(25℃)/156(100℃)
    70MoCu70±2%9.87200(25℃)/196(100℃)
    60MoCu60±2%9.667.5222(25℃)/217(100℃)
    50MoCu50±2%9.510.2250(25℃)/220(100℃)

    Application:

    This composite are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.


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    0.05 Thickness Moly / Copper Heat Sink Material For Automobile Industry

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