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High Power Semiconductor Molybdenum Copper Heatsinks State Of Art Powder Metal Technology

Zhuzhou Jiabang Refractory Metal Co., Ltd
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    Buy cheap High Power Semiconductor Molybdenum Copper Heatsinks State Of Art Powder Metal Technology from wholesalers
     
    Buy cheap High Power Semiconductor Molybdenum Copper Heatsinks State Of Art Powder Metal Technology from wholesalers
    • Buy cheap High Power Semiconductor Molybdenum Copper Heatsinks State Of Art Powder Metal Technology from wholesalers
    • Buy cheap High Power Semiconductor Molybdenum Copper Heatsinks State Of Art Powder Metal Technology from wholesalers

    High Power Semiconductor Molybdenum Copper Heatsinks State Of Art Powder Metal Technology

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    Brand Name : JBNR
    Model Number : HCMC012
    Certification : ISO9001
    Price : Negotiable
    Payment Terms : L/C, D/A, D/P, T/T, Western Union
    Supply Ability : 5 tons a month
    Delivery Time : 15-20 days
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    High Power Semiconductor Molybdenum Copper Heatsinks State Of Art Powder Metal Technology


    State-of-the-art Powder Metal Technology For High Power Semiconductor Molybdenum Copper Heatsinks


    Description:

    With adjustable thermal expansion coefficient and thermal conductivity, Molybdenum Copper Heat sink (MoCu) is a suitable material for heat cooling in microelectronic industry. And the density of molybdenum copper is equal or below 10.01 which is much smaller than that of tungsten copper.

    For some specific industry like automobile and aerospace, Molybdenum Copper Heatsinks is a better choice.


    Advantages:

    1. high thermal conductivity and excellent hermeticity.

    2. 40% lighter weight compared to WCu materials.


    Product Properties:


    GradeMo ContentDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Thermal conductivity W/(M·K)
    85MoCu85±2%10.017200(25℃)/156(100℃)
    80MoCu80±2%9.97170(25℃)/190(100℃)
    70MoCu70±2%9.87.3200(25℃)/196(100℃)
    60MoCu60±2%9.668.4222(25℃)/217(100℃)
    50MoCu50±2%9.510.2250(25℃)/220(100℃)

    Application:

    Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.


    Product Tags:

    molybdenum element

      

    mocu heat sink

      
    Quality High Power Semiconductor Molybdenum Copper Heatsinks State Of Art Powder Metal Technology for sale
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