Efficient Cooling 80/20 Molybdenum Copper 70/30 Molybdenum Copper
Heat Spreader For Instance IGBT Modular
Description:
With
With reliable heat dissipation properties, our molybdenum copper
heat sinks are used widely in electronic components.
Our materials can be often found in the semiconductor components
like high-power transistors, for instance IGBT modules or RF
amplifiers, as well as LED chips.
MoCu heat sinks combine the low thermal expansion of molybdenum and
tungsten with the excellent thermal conductivity of copper. And
with years of experience, we have also tailored composite materials
to meet the requirements of silicon, GaAs and GaN-based
semiconductor materials. So if you choose our materials, you can
avoid failures resulting from overheating or mechanical damage.
Advantages:
1. This molybdenum copper base plates feature high thermal
conductivity and excellent hermeticity.
2. Molybdenum copper flanges are 40% lighter than comparable
tungsten copper composite.
3. If you have doubt about plating, we can give you our suggestions
like nickel thickness, gold thickness.
Besides, if you are design the heat sink in your high power
transistors, we can recommend the suitable material for your
reference.
Product Properties:
| Grade | Mo Content | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
| 70MoCu | 70±2% | 9.8 | 7 | 200(25℃)/196(100℃) |
| 60MoCu | 60±2% | 9.66 | 7.5 | 222(25℃)/217(100℃) |
| 50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Application:
Molybdenum copper heat spreaders are widely used in applications
such as microwave carriers, ceramic substrate carriers, laser diode
mounts, optical packages, power packages, butterfly packages and
crystal carriers for solid state lasers, etc.
