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Moly Copper Thermal Management Carrier Plates Heat Sink For IGBT Modules

Zhuzhou Jiabang Refractory Metal Co., Ltd
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    Buy cheap Moly Copper Thermal Management Carrier Plates Heat Sink For IGBT Modules from wholesalers
     
    Buy cheap Moly Copper Thermal Management Carrier Plates Heat Sink For IGBT Modules from wholesalers
    • Buy cheap Moly Copper Thermal Management Carrier Plates Heat Sink For IGBT Modules from wholesalers
    • Buy cheap Moly Copper Thermal Management Carrier Plates Heat Sink For IGBT Modules from wholesalers
    • Buy cheap Moly Copper Thermal Management Carrier Plates Heat Sink For IGBT Modules from wholesalers
    • Buy cheap Moly Copper Thermal Management Carrier Plates Heat Sink For IGBT Modules from wholesalers

    Moly Copper Thermal Management Carrier Plates Heat Sink For IGBT Modules

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    Brand Name : JBNR
    Model Number : 50MoCu,60MoCu,70MoCu,85MoCu
    Price : Negotiable
    Payment Terms : L/C, , T/T, Western Union
    Delivery Time : 15days
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    Moly Copper Thermal Management Carrier Plates Heat Sink For IGBT Modules


    Moly Copper Thermal Management Carrier Plates For IGBT modules


    Description:

    These composite materials have copper content that can be modified to adapt the base plate’s thermal properties to the entire assembly. Since molybdenum-copper composites are lightweight, they are ideal for those applications where every gram is important. In the automotive industry, for instance, the composites are utilized as carrier plates in the IGBT modules. These modules function as inverters in electric drives.


    Advantages:

    High thermal conductivity due to no sintering additives were used
    Excellent hermeticity
    Relatively small density
    Stampable sheets available (Mo content not more than 75wt.%)
    Semi-finished or finished (Ni/Au plated) parts available


    Product Properties:

    GradeMo ContentDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Thermal conductivity W/(M·K)
    85MoCu85±2%10.07160(25℃)/156(100℃)
    70MoCu70±2%9.87200(25℃)/196(100℃)
    60MoCu60±2%9.667.5222(25℃)/217(100℃)
    50MoCu50±2%9.510.2250(25℃)/220(100℃)

    Application:

    These composite are widely used in applications such as IGBT modules.Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.


    Product picture:

    Moly Copper Thermal Management Carrier Plates Heat Sink For IGBT Modules

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