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High Efficiency Heat Sink Copper Molybdenum Alloy Electronic Packing Material

Zhuzhou Jiabang Refractory Metal Co., Ltd
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    Buy cheap High Efficiency Heat Sink Copper Molybdenum Alloy Electronic Packing Material from wholesalers
     
    Buy cheap High Efficiency Heat Sink Copper Molybdenum Alloy Electronic Packing Material from wholesalers
    • Buy cheap High Efficiency Heat Sink Copper Molybdenum Alloy Electronic Packing Material from wholesalers
    • Buy cheap High Efficiency Heat Sink Copper Molybdenum Alloy Electronic Packing Material from wholesalers
    • Buy cheap High Efficiency Heat Sink Copper Molybdenum Alloy Electronic Packing Material from wholesalers

    High Efficiency Heat Sink Copper Molybdenum Alloy Electronic Packing Material

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    Brand Name : JBNR
    Model Number : 50MoCu,60MoCu,70MoCu,85MoCu
    Certification : ISO9001
    Price : Negotiable
    Payment Terms : L/C, , T/T, Western Union
    Delivery Time : 25days
    • Product Details
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    High Efficiency Heat Sink Copper Molybdenum Alloy Electronic Packing Material


    Heat Sink Molybdenum Copper Electronic Packing Material


    Description:

    MoCu alloy heatsink is a composite made from Mo and Cu. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the composition. But Mo-Cu is much lighter than W-Cu, so that it is more suitable for aeronautic and astronautic applications.


    Advantages:

    High thermal conductivity

    Excellent hermeticity

    Excellent flatness, surface finish, and size control

    Semi-finished or finished (Ni/Au plated) products availabl


    Product Properties:

    GradeMo ContentDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Thermal conductivity W/(M·K)
    85MoCu85±2%10.07160(25℃)/156(100℃)
    70MoCu70±2%9.87200(25℃)/196(100℃)
    60MoCu60±2%9.667.5222(25℃)/217(100℃)
    50MoCu50±2%9.510.2250(25℃)/220(100℃)

    Application:


    Our products are widely used in applications such as heat sink, heat spreader, shim, laser diode submount, substrates, base plate, flange, chip carrier, optical bench, etc.


    Product picture:

    High Efficiency Heat Sink Copper Molybdenum Alloy Electronic Packing Material

    Quality High Efficiency Heat Sink Copper Molybdenum Alloy Electronic Packing Material for sale
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